Exhibiting increased bandwidth, lesser power consumption and increased capacities HBM3 and GDDR6 have been comprehended at Hot Chips 28 .
HBM3 and GDDR6 have been detailed at Hot Chips 28
Offering bandwidth of 15Gb/s Samsung has presented GDDR6 to be released by 2018 and here bandwidth scores comparing to the former with 10Gb/s as we have seen GDDR5X is offering presently and bringing together , with abating power consumption , GDDR6 looks promising , atleast to us.
HBM3 and GDDR6 have been detailed at Hot Chips 28
We have also seen GDDR5X providing 12Gb/s which then will be replaced by GDDR6 along with GDDR5 .
We have seen many people that consider HBM2 as well as other memories can replace GDDR memory standard but here we say that we should keep in mind that HBM2 has complex architecture which is hard to implement and also arise compatibility issues concluding not being affordable.
HBM3 and GDDR6 have been detailed at Hot Chips 28
Servers and HPCs where high bandwidth is a necessity we have seen right now HBM3 is targeting them and also fields like Networking & Graphics sectors where low latency,high bandwidth and high capacities are desirable , there HBM ‘s complex architecture may come into use.
HBM3 and GDDR6 have been detailed at Hot Chips 28
With double the bandwidth than HBM2 and double capacity per chip , HBM3 may hit in around 2019/2020 targeting at severs and HPCs.
We can expect HBM2 memories to power GPU’s by the early 2017 .

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